Re: @Don Jefe
One of the interesting things to watch is the battle over 450mm wafer fabs. The large remaining players - TSMC, Samsung and (perhaps to a lesser extent) Intel want to see 450mm fabs because getting 2.25x more chips per wafer is attractive to improve throughput and somewhat reduce cost.
The problem is that the tool vendors don't want to build them, because they don't see a return when they really have a handful of customers. They broke even - at best - on 300mm tools, and they may go bankrupt building 450mm tools. They'd have as few as two, maybe four or five customers at the very most. The return for them just isn't there. Intel invested in ASML to try to force the issue but still 450mm keeps getting pushed back.
I think the reason Intel's investment didn't help is because even Intel realizes deep down that going to 450mm is not economic for them, at least not unless they become a true foundry and take on big customers like Apple, instead of the tiny ones they've had so far. They have four large fabs now, with 450mm they'll only need two. Not to mention they are supposedly only at 60% utilization on the ones they have!
The economies of scale get pretty thin when you only have two fabs, so Intel is probably better off sticking with 300mm fabs. But they daren't let Wall Street know this, or the money men will realize the jig is up as far as Intel's future growth prospects, and that even Intel may be forced to go fabless sometime after 2020. Their stock price would be cut in half once Wall Street realizes the truth.