Reply to post: Re: 'None of the actors can be taken at face value

Decoding the Chinese Super Micro super spy-chip super-scandal: What do we know – and who is telling the truth?

newspuppy

Re: 'None of the actors can be taken at face value

The embeding of active/passive components can be traced to the 1980's... and IBM published a paper

( https://www.jstage.jst.go.jp/article/jiepeng/2/1/2_1_134/_pdf/-char/en )

<QUOTE>

Embedding components inside a PCB motherboard or a substrate provides literally a new dimension to achieve the needs of today’s high end electronics manufacturing. Component embedding inside a substrate is not a completely new idea, and several technology approaches have been in development over the years – the first real attempt to commercialize an embedding technology was done by GE in mid 80’s.[1] But only now has the market evolved to accept component-embedding solutions and at the same time the infrastructure has matured to a level where component embedding becomes a commercially viable solution.

</QUOTE>

so there are no technical obstacles...

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