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back to article Intel teams with Micron on next-gen many-core Xeon Phi with 3D DRAM

Intel has released more details about its future "Knights Landing" Xeon Phi many-core processor, including a new high-speed interconnect tech called Intel Omni Scale Fabric, as well as on-package Micron Gen2 Hybrid Memory Cube (HMC) DRAM of up to 16GB. Intel presentation slide: what's new in Knights Landing Intel's Silvermont …

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Back to the Pentium III ... err, the Pentium II

Kind of remindes me of the slot processor module first implemented in 1997 on the Pentium II. At least the 350 nm process has been updated.

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Watts

Hopefully they can get the watts down on these.

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