Micron has revealed some of the goals – and the manufacturing challenges it faces – for the development of its next-generation "all silicon" Hybrid Memory Cube (HMC). Micron's current HMC Gen2, engineering samples of which having been released this September, stacks up layers of memory cells, each on an organic laminate …
Clever stuff. Of course for 2 dies you could do face to face bonding.
That should give phenomenal contact density, but only for every 2 die pair in the package.
I guess they're seen the layers between the dies as sort of stress relief layers to absorb some of the forces involved, deforming to accommodate any forces in the dies.
Intriguing to see if they will go to some kind of processing-in-memory that has been proposed off and on since the mid 80's.
Ok, is anyone paying attention to politics?
"harder to create than bipartisan Congressional comity"
Pfff..... you just need to set the subject to "personal enrichment", "pumping money to cronies and spendthrift lobbyists" or "controlling the populace by hook and by crook" and you can have a signed declaration within 5 minutes.
The rest is banana-republic level theater.
They need to design nano-bots to help them put it together.