SanDisk is taking its own technology route to 3D NAND - the stacking of recording layers within a flash chip atop one another to provide more capacity in the same footprint. SanDisk is currently working on its new BiCS (Bit-Cost Scalable NAND) product and it could be deliverable in the fourth quarter of 2015, or sometime during …
This is true 3D computing
Kudos to the development team, who have managed to implement "real" 3D in design, not just by stacking chips. Kudos also to the management who did not squash the idea to go do like everybody else.
I hope this tech will prove itself indeed better than stacking chips, which somehow feels like cheating. If it does, I wonder what the financial impact will be on the cost of foundries. They already cost a few billion to build - if this tech really takes off will that change significantly ?
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