I was doing thickfilm & thinfilm screen printing of circuitry onto beryllium substrates in my garage back when I had a side-line building hybrids ... in 1979. With 8K of memory available, if needs be. On a 1-3cm square chip, with laser-cut resistors & hand-placed SMT kit (pick & place machines were not quite there, yet). Gold-ball bonding provided the "wire" between some components, and to the external world. Add a stainless steel cap to the resulting DIP, seal it with epoxy in a Nitrogen environment, and you've got something that'll last for awhile ... Did everything these clowns are claiming ... and more. Can you say "270G shock resistant", for a start?
Several that I built a third of a century ago are still running greenhouses.