back to article The 3D die stack tack: Toshiba builds towering column of flash

Toshiba is building high rise flash and ReRAM chips, with prototypes coming next year and volume shipping in 2015. The idea of high-rise or 3D chips is that we can sidestep limitations on increasing the storage density of flash or memory chips by stacking them one on top of the other, increasing the storage density on a Mbits/in …

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Boffin

Quantum limit?

Of course, those geniuses who have been coaxing NAND as far as 19nm could very well keep pulling rabbits out of their hats and push it well beyond 10nm - time will tell."

Aren't we going to start seeing quantum mechanics start dominating things if we go too much below 10nm (say around 7nm or so)?

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Re: Quantum limit?

Hence the word Geniuses I presume?

Im sure such boffins are working on 10nm mitigation strategies as we comment....

New equivalents of high k dielectrics and somesuch spring to mind.

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Coat

It looks like a massive cube!

And it's coming straight for us!

Raise Shields!

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WTF?

Acronymtastic

I've never, ever read an article with so many acronyms (and yes, pedants, some of them are abbreviations). There's well over one per line O_o

OMFG, LOL, LMAO, SWALK, etc.

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Meh

This seems like something that was attempted years ago, only to melt down from the heat they generated. Hope they have a solution for that.

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