Using through-silicon vias, Samsung is stacking its memory chips higher and reducing energy consumption. It has a 32GB double data rate-3 (DDR3) RDIMM (Registered Dual-Inline Memory Module) using these through-silicon vias (TSVs) to build this 3D chip. The process technology is 30nm and the RDIMM is built from 4Gbit DDR3 memory …
"It's like making a computer out of rainbows"
Double rainbows? :)
Wow... That's gonna be a lot of power it's sucking up after a few years in the server rack.
Now can you do a 8GB SODIMM that runs at 1333 please? The existing ones are far too expensive, and are a little bit fat.
Apple thanks you for this
Steve will be popping back to 2010 in his time machine to register a patent and design copy so they can sue you in a german court to prevent you selling them and handing over the technology to his Holiness Steve
4.5 Watts per hour
You mean after being installed for a day these DIMMs take more power than the CPU?
Reg units fail
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