One of the issues Apple had with their previous foray into liquid cooled systems was that they leaked and used water. No matter how you spin it, this is a bad combo as some of the unlucky G5 owners can attest. So, what to do; In this patent they use a dielectric fluid (R134a) and flow boil it across the silicon die. Their use of the term heat pipe is wrong, this is not a heat pipe system in anyway shape or form. This is a great process, it provides about 6x more thermal transfer, if the system should ever leak R134a flashes to gas at ambient conditions and is inert even if it doesnt and it's about as good as it gets for a liquid cooling system.
There is only one problem with the patent, it's already being done by a small company in Boston called Thermal Form & Function. They already own the IP for this process, I'm guessing Apple knows this, it's not hard to find so what is there intent with this filing? Either they are way stupid or simply want to take a small company to court and win because they are bigger - hmm bad apple, bad.