TSMC's 3nm node powers up, setting stage for tech giants' next-gen chips
AMD, Apple, Intel throw weight – and cash – behind process technology
Systems
27 Mar 2024 | 3
IBM is teaming up with four other chipmakers to develop manufacturing technologies for semiconductors that shrink the average circuit feature to 32 nanometers. The alliance, which is aimed at containing the spiraling cost of building bleeding-edge chips, also involves Chartered Semiconductor, Samsung Electronics, Infineon …